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Laser Photonics Corporation (LPC), a global developer of industrial laser systems for cleaning and other material processing applications, announced the expansion of its product offering targeting the surging market for chip fabrication.
The growing demand for electronics and electric vehicles, the rise of industrial automation, and the adoption of AI by technologies across all areas are just some factors that are propelling the chip design and fabrication market forward. Some analysts expect the semiconductor market to reach an annual $1 trillion by 2030 on the global scale. Yet, although global supply chains have largely recovered from the COVID-19 pandemic, challenges persist as they struggle to fulfill the high demand for advanced chips. That is why the adoption of high-speed laser processing equipment by chip fabs is more essential than ever.
LPC is providing this laser-powered technology to help accelerate the manufacturing of semiconductors. For the company, a provider of industrial laser equipment for surface preparation, cutting, marking, and welding, chip fabrication has been one of the target sectors. Now, joined by its recently acquired subsidiary, Control Micro Systems, Inc. (CMS), LPC has expanded its product line of advanced laser wafer dicing, marking, and scribing technologies.
One of LPC’s flagship products in this space is the BlackStar laser wafer dicing and scribing system. Engineered with short-pulse laser technology, die singulation by the BlackStar involves minimal heat and does not require water jet cooling to separate brittle materials like silicon. This technique greatly improves die yield while minimizing the need for individual die processing, in turn reducing time and labor.
LPC’s expanded portfolio of products for the semiconductor industry now also includes custom-tailored multi-station laser systems for wafer marking, scribing, and lapping, built to handle a variety of wafer thicknesses and sizes. This technology features robotic wafer positioning and machine vision, and serves to facilitate the production and tracing of chips. Separately, a chip marking system integrating ultraviolet laser technology has been added to its portfolio, which allows for the production of the smallest permanent chip markings without damage to the surrounding microstructure of the die.
“Our growth is fueled by the addition of CMS, and we are excited to expand our product portfolio and offer high-speed, effective laser equipment to chip fabs,” says Wayne Tupuola, CEO of LPC. “We are continuously driven by our mission to upgrade industrial material processing with reliable laser technology. For the semiconductor manufacturing sector, where progress is critical today, we provide automated solutions that greatly optimize the processing of silicon and related brittle materials.”